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LIQUID NAILS SUBFLOOR & DECK CONSTRUCTIO
Solvent-Based Subfloor & Deck Construction Adhesive Permanently Bonds Wet; Frozen And Treated Lumber. It Bridges Gaps Up To 3/8 In. And Virtually Eliminates Squeaky Floors. Easy Cold Weather Gunning Formula. Tough; Weatherproof; Durable And Flexible. Recommended For Bonding Most Common Building Materials; Including: Plywood; Lumber; Engineered Lumber; Particleboard; Treated Lumber; Waferboard And Osb. Not Recommended For Uses Other Than Subfloors; Walls And Decks; Or Underlayment Directly To Concrete Without Proper Vapor Barrier And Fasteners. For Interior And Exterior Use. Coverage: 28 Oz. 85Lnf Using 1/4 In. Bead. Exceeds Astm D-3498; Apa-Afg-01 And Astm C-557 Specifications. Conforms To H
NCP102577313
NCP102577313
LN602
Shipping: Processed & shipped within 2 days
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Product Specifications
Contract ID: 47QSEA19D00AY
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